IBM Unveils 3D-Stacked .7nm Chip Design

IBM says ‘nanostack’ approach could fit nearly 100 billion transistors into fingernail-sized area, amid soaring demand for processing power This article has been indexed from Silicon UK Read the original article: IBM Unveils 3D-Stacked .7nm Chip Design

Chinese-Speaking Hackers Deploy TinyRCT Backdoor Against Critical Energy Infrastructure

A Chinese-speaking threat cluster tracked as CL-STA-1062 has deployed a newly discovered .NET backdoor, TinyRCT, in targeted campaigns against government and critical energy infrastructure across Southeast Asia during 2025. The recent campaign combines common open-source tooling with bespoke malware. Operators…

CISA Adds Actively Exploited Cisco Unified CM Flaws to KEV Catalog

The U.S. Cybersecurity and Infrastructure Security Agency (CISA) has added a critical vulnerability affecting Cisco Unified Communications Manager (Unified CM) to its Known Exploited Vulnerabilities (KEV) Catalog, highlighting active exploitation risks in enterprise communication environments. The newly listed flaw, tracked…